DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES
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摘要: 分别从理论计算、实验研究和失效机理的研究等几个方面综述了微电子封装结构（主要包括多层膜，焊点及引线键合等结构）的热疲劳寿命预估研究领域的进展；并对今后该领域的发展方向进行了预测．Abstract: In this paper, an overview of the development of prediction study on the thermal fatigue life of electronic packages is presented, including theore-tical and experimental aspects as well as failure mechanism analysis. A pro-phecy on the research trend in this area is suggested.
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